Applications
For information about our applications, please click on the links below.
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AVP (Automatic Vacuum Prober)
The AVP is a fully automatic vacuum probing system designed for high rate production test of any device which requires vacuum atmosphere for accurate testing.
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Device Characterization
Device Characterization is performed on all semiconductor chips. Initial designs need to be characterized to determine if the device performed as designed and there are numerous tests performed.
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Discrete Devices
Discrete device testing of small signal diodes to power transistors shares the same requirements as for testing optoelectronic devices. Small diameter and thin wafers with thousands of die place unique demands on probe systems.
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ESD Test
SemiProbe’s high speed, robust semiautomatic PS4L is an ideal platform dedicated to electro static discharge (ESD) test. With PILOT control software, the integration with ESD test software/hardware is seamless.
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Failure Analysis
Failure Analysis (FA) plays a crucial role in the production of semiconductors. It provides usable process and design feedback on the root cause of any failures. Time to data for the FA Engineer is critical and SemiProbe’s Probe System for Life (PS4L) is an ideal tool for this application.
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HF/Microwave Applications DC to >300GHz
HF/Microwave applications require the equipment to provide stability, flexibility and measurement repeatability.
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Known Good Die
More chips are being used in expensive ceramic-based multichip modules (MCMs), flip chip, and other 3D packaging schemes. Customers are requiring fully tested die prior to package placement as the cost to replace the entire package/module because of a faulty single die has a direct impact on the bottom line.
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Laser Microsurgery & Trimming
Laser systems are used in a variety of semiconductor applications ranging from failure analysis to product production and process repairs.
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MEMS, MOEMS & NEMS
MEMS (Micro-electro-mechanical systems), MOEMS (Micro-optical electro-mechanical systems) and NEMS (Nano-electro-mechanical systems) are fabricated and tested using modified semiconductor fabrication technologies.
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Nanotechnology
Controlling matter on the atomic or molecular scale creates unique challenges for test engineers involved in device and materials characterization. However, the possibility for creating not only new products, but entire new industries makes the potential very exciting.
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Optoelectronic Test Systems
SemiProbe has pioneered new methods and capabilities for testing optoelectronic components at wafer level and has extensive experience testing light emitting diodes (LED), vertical cavity surface emitting lasers (VCSEL) and photo diodes.
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PCB & Substrate Testing
Probing printed circuit boards (PCB’s), circuits on flexible plastic substrates (flex-circuits) and other unique devices requires a test platform that enables the user to securely mount the substrate and then reach the region of interest with the appropriate probe.
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Photovoltaics
With the cost of energy skyrocketing, more focus and research is being directed into harnessing the sun's energy to power homes and businesses. Technologies based upon silicon wafer substrates, non-wafer silicon substrates and thin film are all getting attention from R & D to production.
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Pin to Pad Alignment
For many years, production probing systems have offered pin to pad automatic alignment of the probe card to the Device under test (DUT). For applications using vertical array style probe cards, this or a similar alignment system is required.
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Wafer & Die Inspection
SemiProbe's family of IRIS Wafer Inspection System (WIS) enables the user to inspect, locate and identify defects created during wafer processing, packaging, or handling operations. The WIS system excels at analyzing diced die on stretch frame or singulated die in waffle packs to find damaged die.
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