Wafer & Die Inspection

SemiProbe's family of Wafer Inspection Systems (WIS) enable the user to inspect, locate and identify defects created during wafer processing, packaging, or handling operations. The WIS system excels at analyzing diced die on stretch frame or singulated die in waffle packs to find damaged die. With the intuitive PILOT™ control software, the user has the ability to create single and double sided wafer maps, bin and save the results, as well as ink. Built using the patented Probe System for Life ® (PS4L) adaptive architecture, the WIS can be configured for manual or automatic inspection on either a semiautomatic or fully automatic platform.