Wafer Inspection Systems
Semiautomatic and fully automatic systems
Die & Wafer Inspection Systems
SemiProbe's family of Wafer Inspection Systems (WIS) enables the user to inspect, locate and identify defects created during wafer processing, packaging, or handling operations. The WIS system excels at analyzing diced die on stretch frame or singulated die in waffle packs to find damaged die. With the intuitive PILOT control software, the user has the ability to create single and double sided wafer maps, bin and save the results, as well as ink. Built using the patented PS4L adaptive architecture, the WIS can be configured for manual or automatic inspection on either a semiautomatic or fully automatic platform.
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PILOT™ Control Software for wafer probing and inspection systems
An integral part of SemiProbe’s patented adaptive architecture, PILOT control software consists of a number of DLL-based functional modules linked through the SemiServer for communicating to and from the PS4L and other test equipment. Standard control modules include the Navigator and Position Matrix, with a host of more sophisticated capabilities for applications like automated wafer mapping and pattern recognition. Each module has a standard set of interfaces so that it can perform its own specific task, yet access all other features of the software platform seamlessly. Individual customer applications can also be integrated, enhancing the flexibility of the system and decreasing the expense and effort to meaningful data and analysis.
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