Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
All WIS systems are designed based on SemiProbe’s patented adaptive architecture. Unlike traditional inspection systems, all foundation modules – bases, stages, chucks, microscope mounts, microscope movements, optics, manipulators and more – are interchangeable, which makes the WIS the consummate solution for many different applications and budgets. This unique modular design enables customers to acquire inspection capabilities that precisely match their requirements.