
Probe Tips
Probe tips, also called probes or needle probes, are provided in a variety of materials, lengths, shapes and tip radius. They are typically inserted into a single probe arm mounted to a manipulator.
SemiProbe provides a large selection of probe tips. Most are sold in a box of 20 and are made from a straight solid tungsten wire tapered to a desired radius. Other common materials are gold plated tungsten, tungsten carbide and beryllium copper. Click on the following link to get a detailed listing of probe tips offered by SemiProbe.
Probe Tip Cleaning Pads
During the process of probing the probe tip can often pick up foreign particles or debris that get attached to the bottom of the probe tip. The foreign material often negatively impacts the electrical performance of the probe tip causing test data obtained to be false – lower or higher in value than actual. Materials could be metals, oxide, dust particles, human hair, skin flakes and more. SemiProbe provides probe tip cleaning materials. The small pads get affixed to the standard wafer chuck or to an auxiliary pad of a High Frequency chuck via vacuum. The probe tip can be indexed manually or automatically in and out of contact on the cleaning pad. This often removes the foreign particles. Prior to contacting the device the probe tip can carefully be cleaned via a can of air or isopropyl alcohol with a lint free swap.
Probe Tip Selection Guide
Probing | Model | Tip Radious | Tip Material | Shank | Shank Diameter | Overall Length | Comments |
---|---|---|---|---|---|---|---|
Small Geometry | DC - 11014 | 0.10 um | Tungsten | Nickel | 20 mil (0.020") | 35 mm (1.25") | Submicron probe for small feature probing, can easily be bent or cut to length |
Small Geometry | DC - 11018 | 0.15 um | Tungsten | Nickel | 20 mil (0.020") | 35 mm (1.25") | Submicron probe for small feature probing, can easily be bent or cut to length |
Small Geometry | DC - 11015 | 0.25 um | Tungsten | Nickel | 20 mil (0.020") | 35 mm (1.25") | Submicron probe for small feature probing, can easily be bent or cut to length |
Small Geometry | DC - 11003 | 0.35 um | Tungsten | Nickel | 20 mil (0.020") | 35 mm (1.25") | Submicron probe for small feature probing, can easily be bent or cut to length |
Small Geometry | DC - 11012 | 0.50 um | Tungsten | Nickel | 20 mil (0.020") | 35 mm (1.25") | Submicron probe for small feature probing, can easily be bent or cut to length |
Small Geometry | DC - 11000 | 0.75 um | Tungsten | Nickel | 20 mil (0.020") | 35 mm (1.25") | Submicron probe for small feature probing, can easily be bent or cut to length |
Small Geometry | DC - 11037 | 1.0 um | Tungsten | Nickel | 20 mil (0.020") | 35 mm (1.25") | Submicron probe for small feature probing, can easily be bent or cut to length |
Small Geometry | DC - 11010 | 0.60 um | Tungsten | Tungsten | 20 mil (0.020") | 35 mm (1.25") | Submicron solid tungsten probe tip for small feature probing |
Small Geometry | DC - 11029 | 0.75 um | Tungsten | Tungsten | 20 mil (0.020") | 35 mm (1.25") | Submicron solid tungsten probe tip for small feature probing |
Small Geometry | DC - 11004 | 1.0 um | Tungsten | Tungsten | 20 mil (0.020") | 35 mm (1.25") | Solid tungsten probe for structures >4.0 um, general purpose probe |
Small Geometry | DC - 11030 | 1.2 um | Tungsten | Tungsten | 20 mil (0.020") | 35 mm (1.25") | Solid tungsten probe for structures >5.0 um, general purpose probe |
Small Geometry | DC - 11002 | 2.0 um | Tungsten | Tungsten | 20 mil (0.020") | 35 mm (1.25") | Solid tungsten probe for structures >8.0 um, general purpose probe |
Small Geometry | DC - 11005 | 5.0 um | Tungsten | Tungsten | 20 mil (0.020") | 35 mm (1.25") | Solid tungsten probe for structures >20.0 um, general purpose probe |
Bond Pads | DC - 11006 | 7.0 um | Tungsten | Tungsten | 20 mil (0.020") | 35 mm (1.25") | Solid tungsten probe for structures >30.0 um, general purpose probe |
Bond Pads | DC - 11008 | 10.0 um | Tungsten | Tungsten | 20 mil (0.020") | 35 mm (1.25") | Solid tungsten probe for structures >40.0 um, general purpose probe |
Bond Pads | DC - 11009 | 12.5 um | Tungsten | Tungsten | 20 mil (0.020") | 35 mm (1.25") | Solid tungsten probe for structures >50.0 um, general purpose probe |
Bond Pads | DC - 11013 | 20.0 um | Tungsten | Tungsten | 20 mil (0.020") | 35 mm (1.25") | Solid tungsten probe for structures >80.0 um, general purpose probe |
Bond Pads | DC - 11007 | 25.0 um | Tungsten | Tungsten | 20 mil (0.020") | 35 mm (1.25") | Solid tungsten probe for structures >100.0 um, general purpose probe |
Bond Pads | DC - 11016 | 7.0 um | Gold Plated | Tungsten | 20 mil (0.020") | 35 mm (1.25") | Gold Plated solid tungsten probe for features > 30.0 um, reduced contact resistance, used to probe gold contacts/pads |
Bond Pads | DC - 11031 | 10.0 um | Gold Plated | Tungsten | 20 mil (0.020") | 35 mm (1.25") | Gold Plated solid tungsten probe for features > 40.0 um, reduced contact resistance, used to probe gold contacts/pads |
Bond Pads | DC - 11032 | 12.5 um | Gold Plated | Tungsten | 20 mil (0.020") | 35 mm (1.25") | Gold Plated solid tungsten probe for features > 50.0 um, reduced contact resistance, used to probe gold contacts/pads |
Bond Pads | DC - 11033 | 15.0 um | Gold Plated | Tungsten | 20 mil (0.020") | 35 mm (1.25") | Gold Plated solid tungsten probe for features > 60.0 um, reduced contact resistance, used to probe gold contacts/pads |
Bond Pads | DC - 11019 | 20.0 um | Gold Plated | Tungsten | 20 mil (0.020") | 35 mm (1.25") | Gold Plated solid tungsten probe for features > 80.0 um, reduced contact resistance, used to probe gold contacts/pads |
Bond Pads | DC - 11034 | 25.0 um | Gold Plated | Tungsten | 20 mil (0.020") | 35 mm (1.25") | Gold Plated solid tungsten probe for features > 100.0 um, reduced contact resistance, used to probe gold contacts/pads |
Bond Pads | DC - 11035 | 5.0 um | Tungsten Carbide | Tungsten Carbide | 20 mil (0.020") | 35 mm (1.25") | Tungsten Carbide probe for feature > 20.0 um, can be used for cutting & high temperature applications |
Bond Pads | DC - 11020 | 7.5 um | Tungsten Carbide | Tungsten Carbide | 20 mil (0.020") | 35 mm (1.25") | Tungsten Carbide probe for feature > 30.0 um, can be used for cutting & high temperature applications |
Bond Pads | DC - 11036 | 10.0 um | Tungsten Carbide | Tungsten Carbide | 20 mil (0.020") | 35 mm (1.25") | Tungsten Carbide probe for feature > 40.0 um, can be used for cutting & high temperature applications |
Bond Pads | DC - 11021 | 12.5 um | Tungsten Carbide | Tungsten Carbide | 20 mil (0.020") | 35 mm (1.25") | Tungsten Carbide probe for feature > 50.0 um, can be used for cutting & high temperature applications |
Bond Pads | DC - 11022 | 20.0 um | Tungsten Carbide | Tungsten Carbide | 20 mil (0.020") | 35 mm (1.25") | Tungsten Carbide probe for feature > 80.0 um, can be used for cutting & high temperature applications |
Bond Pads | DC - 11023 | 25.0 um | Tungsten Carbide | Tungsten Carbide | 20 mil (0.020") | 35 mm (1.25") | Tungsten Carbide probe for feature > 100.0 um, can be used for cutting & high temperature applications |
Bond Pads | DC - 11028 | 5.0 um | Beryllium Copper | Beryllium Copper | 20 mil (0.020") | 35 mm (1.25") | Solid Bery lilium Copper probe for measurements requiring low contact resistance, soft material reduces pad damage |
Bond Pads | DC - 11001 | 7.0 um | Beryllium Copper | Beryllium Copper | 20 mil (0.020") | 35 mm (1.25") | Solid Bery lilium Copper probe for measurements requiring low contact resistance, soft material reduces pad damage |
Bond Pads | DC - 11024 | 10.0 um | Beryllium Copper | Beryllium Copper | 20 mil (0.020") | 35 mm (1.25") | Solid Bery lilium Copper probe for measurements requiring low contact resistance, soft material reduces pad damage |
Bond Pads | DC - 11025 | 12.5 um | Beryllium Copper | Beryllium Copper | 20 mil (0.020") | 35 mm (1.25") | Solid Bery lilium Copper probe for measurements requiring low contact resistance, soft material reduces pad damage |
Bond Pads | DC - 11026 | 20.0 um | Beryllium Copper | Beryllium Copper | 20 mil (0.020") | 35 mm (1.25") | Solid Bery lilium Copper probe for measurements requiring low contact resistance, soft material reduces pad damage |
Bond Pads | DC - 11027 | 25.0 um | Beryllium Copper | Beryllium Copper | 20 mil (0.020") | 35 mm (1.25") | Solid Bery lilium Copper probe for measurements requiring low contact resistance, soft material reduces pad damage |