Probe Tip Selection Guide

Probing
Model
Tip Radious
Tip Material
Shank
Shank Diameter
Overall Length
Comments
Small GeometryDC - 110140.10 umTungstenNickel20 mil (0.020")35 mm (1.25")Submicron probe for small feature probing, can easily be bent or cut to length
Small GeometryDC - 110180.15 umTungstenNickel20 mil (0.020")35 mm (1.25")Submicron probe for small feature probing, can easily be bent or cut to length
Small GeometryDC - 110150.25 umTungstenNickel20 mil (0.020")35 mm (1.25")Submicron probe for small feature probing, can easily be bent or cut to length
Small GeometryDC - 110030.35 umTungstenNickel20 mil (0.020")35 mm (1.25")Submicron probe for small feature probing, can easily be bent or cut to length
Small GeometryDC - 110120.50 umTungstenNickel20 mil (0.020")35 mm (1.25")Submicron probe for small feature probing, can easily be bent or cut to length
Small GeometryDC - 110000.75 umTungstenNickel20 mil (0.020")35 mm (1.25")Submicron probe for small feature probing, can easily be bent or cut to length
Small GeometryDC - 110371.0 umTungstenNickel20 mil (0.020")35 mm (1.25")Submicron probe for small feature probing, can easily be bent or cut to length
Small GeometryDC - 110100.60 umTungstenTungsten20 mil (0.020")35 mm (1.25") Submicron solid tungsten probe tip for small feature probing
Small GeometryDC - 110290.75 umTungstenTungsten20 mil (0.020")35 mm (1.25")Submicron solid tungsten probe tip for small feature probing
Small GeometryDC - 110041.0 umTungstenTungsten20 mil (0.020")35 mm (1.25")Solid tungsten probe for structures >4.0 um, general purpose probe
Small GeometryDC - 110301.2 umTungstenTungsten20 mil (0.020")35 mm (1.25")Solid tungsten probe for structures >5.0 um, general purpose probe
Small GeometryDC - 110022.0 um TungstenTungsten20 mil (0.020")35 mm (1.25")Solid tungsten probe for structures >8.0 um, general purpose probe
Small GeometryDC - 110055.0 um TungstenTungsten20 mil (0.020")35 mm (1.25")Solid tungsten probe for structures >20.0 um, general purpose probe
Bond PadsDC - 110067.0 umTungstenTungsten20 mil (0.020")35 mm (1.25")Solid tungsten probe for structures >30.0 um, general purpose probe
Bond PadsDC - 1100810.0 um TungstenTungsten20 mil (0.020")35 mm (1.25")Solid tungsten probe for structures >40.0 um, general purpose probe
Bond PadsDC - 1100912.5 umTungstenTungsten20 mil (0.020")35 mm (1.25")Solid tungsten probe for structures >50.0 um, general purpose probe
Bond PadsDC - 1101320.0 umTungstenTungsten20 mil (0.020")35 mm (1.25")Solid tungsten probe for structures >80.0 um, general purpose probe
Bond PadsDC - 1100725.0 umTungstenTungsten20 mil (0.020")35 mm (1.25")Solid tungsten probe for structures >100.0 um, general purpose probe
Bond PadsDC - 110167.0 um Gold PlatedTungsten20 mil (0.020")35 mm (1.25")Gold Plated solid tungsten probe for features > 30.0 um, reduced contact resistance, used to probe gold contacts/pads
Bond PadsDC - 1103110.0 um Gold PlatedTungsten20 mil (0.020")35 mm (1.25")Gold Plated solid tungsten probe for features > 40.0 um, reduced contact resistance, used to probe gold contacts/pads
Bond PadsDC - 1103212.5 um Gold PlatedTungsten20 mil (0.020")35 mm (1.25")Gold Plated solid tungsten probe for features > 50.0 um, reduced contact resistance, used to probe gold contacts/pads
Bond PadsDC - 1103315.0 um Gold PlatedTungsten20 mil (0.020")35 mm (1.25")Gold Plated solid tungsten probe for features > 60.0 um, reduced contact resistance, used to probe gold contacts/pads
Bond PadsDC - 1101920.0 um Gold PlatedTungsten20 mil (0.020")35 mm (1.25")Gold Plated solid tungsten probe for features > 80.0 um, reduced contact resistance, used to probe gold contacts/pads
Bond PadsDC - 1103425.0 um Gold PlatedTungsten20 mil (0.020")35 mm (1.25")Gold Plated solid tungsten probe for features > 100.0 um, reduced contact resistance, used to probe gold contacts/pads
Bond PadsDC - 110355.0 um Tungsten CarbideTungsten Carbide20 mil (0.020")35 mm (1.25")Tungsten Carbide probe for feature > 20.0 um, can be used for cutting & high temperature applications
Bond PadsDC - 110207.5 umTungsten CarbideTungsten Carbide20 mil (0.020")35 mm (1.25")Tungsten Carbide probe for feature > 30.0 um, can be used for cutting & high temperature applications
Bond PadsDC - 1103610.0 um Tungsten CarbideTungsten Carbide20 mil (0.020")35 mm (1.25")Tungsten Carbide probe for feature > 40.0 um, can be used for cutting & high temperature applications
Bond PadsDC - 1102112.5 umTungsten CarbideTungsten Carbide20 mil (0.020")35 mm (1.25")Tungsten Carbide probe for feature > 50.0 um, can be used for cutting & high temperature applications
Bond PadsDC - 1102220.0 um Tungsten CarbideTungsten Carbide20 mil (0.020")35 mm (1.25")Tungsten Carbide probe for feature > 80.0 um, can be used for cutting & high temperature applications
Bond PadsDC - 1102325.0 um Tungsten CarbideTungsten Carbide20 mil (0.020")35 mm (1.25")Tungsten Carbide probe for feature > 100.0 um, can be used for cutting & high temperature applications
Bond PadsDC - 110285.0 um Beryllium CopperBeryllium Copper20 mil (0.020")35 mm (1.25")Solid Bery lilium Copper probe for measurements requiring low contact resistance, soft material reduces pad damage
Bond PadsDC - 110017.0 um Beryllium CopperBeryllium Copper20 mil (0.020")35 mm (1.25")Solid Bery lilium Copper probe for measurements requiring low contact resistance, soft material reduces pad damage
Bond PadsDC - 1102410.0 um Beryllium CopperBeryllium Copper20 mil (0.020")35 mm (1.25")Solid Bery lilium Copper probe for measurements requiring low contact resistance, soft material reduces pad damage
Bond PadsDC - 1102512.5 um Beryllium CopperBeryllium Copper20 mil (0.020")35 mm (1.25")Solid Bery lilium Copper probe for measurements requiring low contact resistance, soft material reduces pad damage
Bond PadsDC - 1102620.0 um Beryllium CopperBeryllium Copper20 mil (0.020")35 mm (1.25")Solid Bery lilium Copper probe for measurements requiring low contact resistance, soft material reduces pad damage
Bond PadsDC - 1102725.0 um Beryllium CopperBeryllium Copper20 mil (0.020")35 mm (1.25")Solid Bery lilium Copper probe for measurements requiring low contact resistance, soft material reduces pad damage

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